Device tree binding vendor prefix registry. Keep list in alphabetical order.
This isn’t an exhaustive list, but you should add new prefixes to it before
using them to avoid name-space collisions.
ad Avionic Design GmbH
adi Analog Devices, Inc.
aeroflexgaisler Aeroflex Gaisler AB
ak Asahi Kasei Corp.
amcc Applied Micro Circuits Corporation (APM, formally AMCC)
apm Applied Micro Circuits Corporation (APM)
arm ARM Ltd.
atmel Atmel Corporation
bosch Bosch Sensortec GmbH
brcm Broadcom Corporation
cavium Cavium, Inc.
chrp Common Hardware Reference Platform
cirrus Cirrus Logic, Inc.
cortina Cortina Systems, Inc.
dallas Maxim Integrated Products (formerly Dallas Semiconductor)
denx Denx Software Engineering
emmicro EM Microelectronic
epson Seiko Epson Corp.
est ESTeem Wireless Modems
fsl Freescale Semiconductor
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
hp Hewlett Packard
ibm International Business Machines (IBM)
idt Integrated Device Technologies, Inc.
img Imagination Technologies Ltd.
intercontrol Inter Control Group
linux Linux-specific binding
marvell Marvell Technology Group Ltd.
maxim Maxim Integrated Products
mosaixtech Mosaix Technologies, Inc.
national National Semiconductor
nintendo Nintendo
nvidia NVIDIA
nxp NXP Semiconductors
onnn ON Semiconductor Corp.
picochip Picochip Ltd
powervr PowerVR (deprecated, use img)
qcom Qualcomm, Inc.
ralink Mediatek/Ralink Technology Corp.
ramtron Ramtron International
realtek Realtek Semiconductor Corp.
renesas Renesas Electronics Corporation
samsung Samsung Semiconductor
sbs Smart Battery System
schindler Schindler
sil Silicon Image
silabs Silicon Laboratories
simtek
sirf SiRF Technology, Inc.
snps Synopsys, Inc.
st STMicroelectronics
ste ST-Ericsson
stericsson ST-Ericsson
ti Texas Instruments
toshiba Toshiba Corporation
via VIA Technologies, Inc.
wlf Wolfson Microelectronics
wm Wondermedia Technologies, Inc.
winbond Winbond Electronics corp.
xlnx Xilinx
