Kernel-3.10.0-957.el7_db8500-thermal

• ST-Ericsson DB8500 Thermal

** Thermal node properties:

• compatible : “stericsson,db8500-thermal”;
• reg : address range of the thermal sensor registers;
• interrupts : interrupts generated from PRCMU;
• interrupt-names : “IRQ_HOTMON_LOW” and “IRQ_HOTMON_HIGH”;
• num-trips : number of total trip points, this is required, set it 0 if none,
  if greater than 0, the following properties must be defined;
• tripN-temp : temperature of trip point N, should be in ascending order;
• tripN-type : type of trip point N, should be one of “active” “passive” “hot”
  “critical”;
• tripN-cdev-num : number of the cooling devices which can be bound to trip
  point N, this is required if trip point N is defined, set it 0 if none,
  otherwise the following cooling device names must be defined;
• tripN-cdev-nameM : name of the No. M cooling device of trip point N;

Usually the num-trips and tripN-*** are separated in board related dts files.

Example:
thermal@801573c0 {
compatible = “stericsson,db8500-thermal”;
reg = <0x801573c0 0x40>;
interrupts = <21 0x4>, <22 0x4>;
interrupt-names = “IRQ_HOTMON_LOW”, “IRQ_HOTMON_HIGH”;

num-trips = <3>;

trip0-temp = <75000>;
trip0-type = "active";
trip0-cdev-num = <1>;
trip0-cdev-name0 = "thermal-cpufreq-0";

trip1-temp = <80000>;
trip1-type = "active";
trip1-cdev-num = <2>;
trip1-cdev-name0 = "thermal-cpufreq-0";
trip1-cdev-name1 = "thermal-fan";

trip2-temp = <85000>;
trip2-type = "critical";
trip2-cdev-num = <0>;

}